ActInPak Conference Second MC/WG meeting

Bled Actinpak Confrence

November 21–23, 2016

 Venue: Hotel Astoria, Bled, Slovenia

Contact person: Diana Gregor Svetec

Second MC/WG meeting will take place from 21 to 23 November 2016 and is combined with the Papermakers Conference in Bled, Slovenia. The meeting will be comprised of Management Committee and Working Group meetings, Conference, as well as session jointly organised with the Papermakers Conference on Wednesday.


Time Event
Monday 21st of November
13:00 - 13:45 Registration and welcome coffee/tea
14:00 - 17:00 Management Committee Meeting (mandatory for all pre-registered MC members)
14:00 - 17:00 Live virtual showroom, and display of STSM videos
19:00 ActInPak dinner
Tuesday 22nd of November
9:00 - 10:30 Working Group Meetings
10:30 - 11:00 Coffee break
11:00 - 12:30 Working Group Meetings
12:30 - 13:30 Lunch
13:30 - 14:30 Plenary Working Groups session
14:30 - 15:00 Coffee break
15:00 - 15:25

Market introduction of active and intelligent packaging by AIPIA members – Andrew Manly, AIPIA, Netherlands

15:25 - 15:50

Nano Crystalline Cellulose (NCC), Bio-building blocks for tomorrow’s materials – Tal Ben-Shalom, Melodea, Israel

15:50 - 16:15 Presentations by ActInPak’s Short Term Scientific Mission students: Charlène Reverdy, LGP2, France - Manufacturing and measurement of superhydrophobicity for paperbased active packaging
16:15 - 16:30 Christian Kossel, PTS, Germany - Potential applications of electrohydrodynamic processes in paper and board - Use of cellulosic nanofibers for high performance papermaking products;
16:30 - 16:45 Urška Vrabič Brodnjak, University of Ljubljana, Slovenia - Obtaining of paper samples, containing of bio-based components and investigation on its influence over the properties of paper;

16:45 - 16:50

Introduction to student contest, by Julien Bras
16:50 - 17:00 Isaure Grauge - Label as detector of bacteria - what future does it have in smart packaging?
17:00 Closure
Wednesday 23rd of November
9:00 - 9:10 ActInPak Conference, Intro by session chair Johanna Lahti
9:10 - 9:30 Ionizing radiation and plasma discharge mediating covalent linking of bioactive compounds onto polymeric substrate to obtain stratified composites for food packaging - Cornelia Vasile, Romanian Academy, “P. Poni” Institute of Macromolecular Chemistry Iasi, Romania
9:30 - 9:50 Tailoring chitosan film properties for food applications - Cláudia Nunes, CICECO - Aveiro Institute of Materials, University of Aveiro, Portugal
9:50 - 10:10 Towards the development of bioactive packaging – Zvi Hayouka, Institute of Biochemistry, Food Science and Nutrition, Jerusalem, Israel
10:10 - 10:30 Renewable active food packaging using potato chip industry byproducts - Idalina Gonçalves, QOPNA, Department of Chemistry, University of Aveiro, Portugal
10:30 - 10:50 Active packaging by the use of CO2 emitter – Adjustment and optimization related to product and packaging concepts – and the effect on shelf life of chicken filets - Marit Kvalvåg Pettersen, Nofima AS, Aas, Norway
10:50 - 11:10 Comparative migration testing of bioactive components from different polymeric food packaging films - Raluca Petronela Dumitriu, Romanian Academy, “P. Poni” Institute of Macromolecular Chemistry Iasi, Romania
11:10 - 11:40 Coffee break
11:40 - 12:00 Electrospun Coatings Based on Graphene for Intelligent Packaging Applications – Adriane Cherpinski, Novel Materials and Nanotechnology Group, IATA-CSIC, Valencia, Spain
12:20 - 12:20 Review on printed electronics development presented at Drupa – Deja Muck, University of Ljubljana, Slovenia
12:20 - 12:40 Paper as substrate for printed electronics and sensors – Martti Toivakka, Åbo Akademi University, Finland
12:40 - 13:00 The perception of packaging innovations in Slovakia - Ján Parobek, Department of Marketing, Trade and World Forestry, Technical University in Zvolen, Slovakia

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Presentations from this event are available at subpage Presentations from COST events.

Take HOME Messages


  • Society and even packaging industry is still not enough informed about A&I packaging. We need to reach out to them on different levels (general public, industry, etc)


  • How can we more involve the industrial partners?
  • Industry seems to prefer fleshed out technologies, so we should talk to integrator of bits and pieces to prepare the right level of readiness. However, it is unknown to the research partners who the integrator of bits and pieces, and thus the best partner for us to talk to, is.


  • To involve young scientists we have launched the Student Contest. Spread the word so we can welcome their ideas in our next meeting.
  • Social scientists views are welcome to grab the whole picture and get more involved with society.